Solder solar energy absorption of heat implement

2 Mm. The price of sheet copper rises ceaselessly, because this must be searched,replace content, include to contain the aluminium chip of alternative coating at present, it is when 20 ℃ , hot conductivity is 220W/mK, and hot conductivity of copper is 384W/mK. The conductivity of other aluminium alloy is smaller, and can be brought about because of the metallographic quality that reduce likely slacken of intensity of shock machine instrument is fought after the metal is soldering. Heat up the element with inferior conductivity to compensate aluminium, need increases aluminium piece ply. In face plate of flat thermal collector, copper pipe is mixed from heat machinery is linked together with face plate in light of two respects. Heat mediumly in conduit liquid (it is water normally, added a few constituent to freeze in order to reduce among them temperature, increase boiling point) through main canal sending water draw-out and carry an user, perhaps be by Chu Fang in cistern. To ensure efficient, to liquid from conduit hot move also needs fibrous root chooses liquid discharge to undertake optimizing according to place. The hot move efficiency of onflow is taller, but, the laminar flow that needs pressure difference compares same discharge is a lot of larger. In this respect, in absorption of heat implement in bent conduit type has an advantage relatively. Quantity of heat to all round material and the hot loss intention that air changes can pass appropriate adiabatic method to decrease. Why to use laser? The pipeline that uses proper heat and rigid step to will install water and absorption of heat implement chip join rises, this to solar energy absorption of heat implement for efficiency very important. This join must be satisfied following a few requirements, include: Energy conductivity is tall; Mechanical strength is good, with bearing temperature gradient and heat expand; To absorption of heat implement the fire damage of coating is little, in order to maintain the outward appearance; To absorption of heat implement chip heat is out of shape small; Won't be corroded, with assuring to be able to be used for long; Productivity is tall; Dependability and but repeatability is good; Treatment process easy conformity arrives in manufacturing system; Cost is low. The treatment method of the choice is fusion welding and technology of solder of soft drill rod. Solder of soft drill rod has certain limitation, because be below a few specific situation (critical point is in) 3 measures temperature are very high (> 220 ℃ ) , in addition, to environmental requirement, and the application that cankerous possibility restricted it. And when technology of use fusion welding, use ultrasonic solders system or pulse Nd:YAG solid laser beam welding accepts a system. Laser beam welding is received offerred more agile, be not the process of contact, productivity taller and quality is better. However, the investment cost of laser system wants than the investment of ultrasonic system tall. Nextpage is in copper - the facula that arises by laser on the material that copper combines solders. The copper that illustration gave out to be received by laser beam welding - absorption of heat of aluminous solar energy implement. Reflection design says palpability is in aluminous absorption of heat implement board on have a few heat is out of shape the laser spot welding of two side (if pursue 2) the requirement that satisfied much to allude. Noticing solder drop is not in absorption of heat of conduit and flat implement on osculatory line. Such, say from the principle, the laser spot welding here has 3 heat energy to change section. Hot conductivity is the solder that goes up by solder wiring dot space distributings get. Its distance is in 1 to 3mm. Do not recommend use less space, because stimulate the pulse with finite illuminant to repeat frequency to will bring about productivity to drop, the absorption of heat that at the same time this takes cause heat energy to cause likely implement be out of shape chiply. Latter and OK through soldering appropriately the method is reduced. Connective machinery intensity, fight for example shear strength and combat impact strength, also rely on the density that solder nods. The absorption of heat in the model implement have on face plate be more than 20, 000 solder contact. 3 in copper - below connection case of copper, joint has the mechanical strength with move and base similar metal. In copper (canal) - aluminous (chip) in combination, of joint combat impact strength weaker, it depends on the type of alloy and the metallographic character that bring about from this. Still must consider use the likelihood below contact of two kinds of different metals and the case in moisture to be corroded. Use fight corrode a layer to be able to reduce pair of aluminium to make absorption of heat implement chip electrochemistry is corroded. In the 2 processes that receive in laser beam welding, with the high temperature chemistry of air happening reaction arose to defend alumina layer of the gender. The compulsive ageing that asks by ISO checks, confirmed the effectiveness of these processes. 2 is having different hot coefficient of expansion because of copper and aluminium (20 degrees when, aluminous: 23.

8 10-6/K; Copper: 16.

8 10-6/K) , copper pipe is mixed aluminium board must be pressed together, the area of impaction solders namely the place that have, make absorption of heat in order to avoid aluminium implement chip and excessive be out of shape. The combination of every kinds of material to face plate and geometrical compose, what we optimized laser pulse is indispensible solder energy and pulse width, the destruction that this reduced rear to weld alternative coating (if pursue 2) . Jump over relative to the spoke angle of fire at flat surface small, soldering efficiency is taller, requires pulse energy is less. To copper - cupreous combination, incident when be 20 degrees, needs pulse energy type is worth is 8 J. Used short pulse (<1 Ms) the loss that conducts in order to reduce heat. It is better to because aluminous material character is mixed,absorb character, aluminous - the energy that cupreous combination issues place to need in same radiation condition is less than 5 J. For tall to average power laser, this allows appropriate repetition frequency, make thereby manufacturing rate is 9 M/min about, a gotten solder is nodded, the interval that its are nodded and nods is 2 Mm. Can use prismatic component to share same bundle of laser energy, take-over with same speed solder two side. Terminal was used to produce systematic a future life to produce solar energy absorption of heat here implement, it is used at the conduit with different type, and disparate material combination test shows small angle of use laser light beam is incident, can reduce pulse energy. Such, the pipeline that uses small diameter and small cone angle (numeric aperture) focusing beam of light is more advantageous. In system of laser beam machining, fiber-optic be used to normally guide laser radiate welder makes a station. Use numeric aperture NA =0.

Of 11 fiber-optic, to conduit the distance is the typical situation of 100mm, cone angle can reduce 10 degrees or so. In such device, compare with afore-mentioned numeric photograph, manufacturing rate can rise 20% . We from the graph 2 in the case that drops with respect to energy of understandable spot welding. Angle is smaller, need connective space is less, corresponding, need is fused use at connective material fewer. Also see likewise, when reducing radiation role, juncture is mixed toward pipe board osculatory line direction is mobile. In addition, at present Nd:Y of pulse solid stateThe pulse plastics that AG laser offerred time domain solders with optimizing process. 3 to given radiation horn, one additional usable will optimize solder the position that the element of the process is focusing facula. Optimize solder the energy of pulse also can stabilize treatment process, reduce hot side effect. Manufacturing system is current already promising is specific absorption of heat implement those who make is automatic solder system, will get absorption of heat implement or radiator. Graph 3 in it is system of production of a kind of terminal, produce absorption of heat of whole solar energy with a future life implement face plate. These board typical size is 1200 X 2000mm. May have on the design some different, perhaps bend model single pipe, have 10-12 possibly also the conduit of the entrance on straight canal and face plate and exit joins together. To let solder reliable and can repeat production, conduit must with absorption of heat implement contact of face plate posture, and, its position must be in the less than of hundreds of micron of position of focus of laser light beam. This problem has gotten settlement in producing a system actually. Current, even if production is more complex curve conduit, the error rate that spot welding receives still is less than 200 Ppm4. Exceed 20 absorption of heat to improve productivity implement / hour, must optimize not only solder process, and must actor or actress masked discharge moves process and fixed position time, fixed position time is by absorption of heat implement design a decision, it is to point to solder used optical cell along bent method, move from a conduit the fixed position time in another conduit process. Conclusion flat copper - copper is aluminous perhaps - solar energy absorption of heat of copper implement satisfied the requirement that fights wallop to thermal efficiency and machinery. System of use pulse laser can undertake with high birth rate reliable and but reduplicative solders. Especially to more economy copper - aluminous union, it is better that laser beam welding receives the machines a process reliability that can offer, in addition, with its he joins process photograph is compared, it reduced cankerous risk to the greastest extent. CNC Milling CNC Machining